Winbond - Corporate Officers
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Corporate Officers

Chairman & CEO
Arthur Yu-Cheng Chiao

Education
MS/ Major-Electrical Engineering/ University of Washington
BS/ Major-Telecommunication Engineering/ National Chiao Tung University
Major Experience
Chairman, Walsin Lihwa Corp.


President
Tung-Yi, Chan

Education
Ph.D./ Major-Electrical Engineering/ University of California, Berkeley, USA
MS/ Major-Electrical Engineering/ University of California, Berkeley, USA
MS/ Major-Management Science/ Stanford University
BS/ Major-Electrical Engineering/ National Taiwan University
Major Experience
CEO, BCD Semiconductor 
Vice President of Sales Center, Winbond Electronics Corp.
Technology Executive, Winbond Electronics Corp.
President, Winbond Electronics Corp. America
AVP of Product Center III, Winbond Electronics Corp. America
Director of Research and Development Division I, Winbond Electronics Corp. America
Technology Manager, Siliconix
Technology Manager, Cypress
Senior Engineer, Intel, 

Vice President of President’s Office

Pei-Lin Pai

Education

Ph. D./ Major-Electrical Engineering from University of California, Berkeley, USA.
MS/ Major-Electrical Engineering/ University of California, Berkeley, USA
BS/ Major-Electrical Engineering/ National Taiwan University
Major Experience

Vice President of Focal Tech Corp.

Vice President of Nanya Technology Corp.

President of Ascend Semiconductor Corp.

Marketing Director of Vanguard International Semiconductor Corp.

Engineering Vice President of Omega Micro Technologies, Inc.

Engineering Manager of Cypress Semiconductor Corp.

Senior Process Engineer of Intel Corp.


                                                                                                                 

Executive Vice President of Memory IC Manufacturing Business Group
Wilson Wen

Education
BS/ Major-Electronic Physics/ National Chiao Tung University
Major Experience
Executive Vice President of Memory IC Manufacturing Business Group / Administration Service Center,
Winbond Electronics Corp.
CEO, Hannstar Display Corp.
Assistant Vice President of Manufacturing Center, Winbond Electronics Corp.
Manager, ERSO of ITRI


Vice President of DRAM Product Business Group
Pei-Ming Chen

Education
MS/ Major- Electrical Engineering/ University of Detroit
BS/ Major-Electrical Engineering/ National Cheng Kung University
Major Experience
AVP of Product Center II, Winbond Electronics Corp. 


Vice President of Technology R&D Group
Chen-Hsi Lin

 
Education
Ph.D./ Major- Applied Physics/ Harvard University
MS/ Major- Applied Physics/ Harvard University
BS/ Major-Physics/ National Taiwan University
Major Experience
Vice President of Design and Technology R&D Group, Winbond Electronics Corp.
Assistant Vice President of Emerging Technology Center, Winbond Electronics Corp.
Deputy Divisional Director of Corporate Marketing & Technology Development, UMC
Senior Director of Technology Development Division, UTEK
Director of Technology Development, WSMC
Director of Emerging Technology Development Division, Winbond Electronics Corp.
Senior member of Logic Technology Division, AMD
Technology Manager of IC Business Division, Hewlett-Packard 
Technical Staff of EE Department, MIT 

 

Vice President of Administration Service Group
Cheng-Kung Lin

Education
MS/ Major- Engineering / National Taiwan Institute of Technology
BS/ Major- Applied Mathematics/ Fu Jen Catholic University
Major Experience
Vice President of Knowledge & Information Management Group, Winbond Electronics Corp.
Assistant Vice President of Information Management Center, Winbond Electronics Corp.
Assistant Vice President of Knowledge Management Center, Winbond Electronics Corp.
Deputy Manager, Walsin Lihwa Corp.


Vice President of Finance Center & CFO
James Wen

Education
MS/ Major- MBA/ Wharton School of the University of Pennsylvania
MS/ Major- MBA/ Tamkang University
BS/ Major- Industrial Engineering Dept. / Tunghai University
Major Experience
President, Cathay Investment Trust Corp.
President, Masterlink Securities Corp.
Vice President, KGI Securities Corp.
Section Manager, China Development Industrial Bank
Assistant Vice President of Sales, Bankers Trust

 

Vice President of Quality & ESH Center
Jing-Fong Tsai

Education
Ph.D./ Major-Materials Science and Engineering/ University of Utah, SLC, Utah, USA
MS/ Major-Materials Science and Engineering/ National Tsing Hua University
BS/ Major- Metallurgy and Materials Engineering /National Cheng Kung University
Major Experience
Vice President of Technology and Chief Technology Officer, General Electronic Materials Corporation 
Vice President, Eversol Corporation
Deputy director of QRA, United Microelectronics Corporation
Quality assurance supervisor, Phoenix Silicon International Corporation
Technical manager, Monsanto Electronic Materials Company
Senior process engineer, National Semiconductor Corporation
Research & development engineer, Metal Industries Research & Development Centr


Vice President of Sales Center
Yuan-Mou Su

Education
MS/ Major -Electrical Engineering/ University of Southern California
BS/ Major-Electrical Engineering/ National Chiao Tung University
Major Experience
Assistant Vice President of DRAM/ SRAM Product Center, Winbond Electronics Corp.
Assistant Vice President of DRAM Product Center, Winbond Electronics Corp.
Senior Vice President, Winbond Electronics Corp. America
Director, Winbic Semiconductor, Inc.
Senior Design Engineer, Integrated Devices Technology, Inc.
Senior Design Engineer, Digital Equipment Corp.
Senior Design Engineer, Advanced Micro Devices, Inc