Winbond - Product Promotion
Home \\ News & Events \ Events \ Product Promotion

Event Bulletin Board

Product Promotion

DateEventDescriptionLocationBooth
2014/11/11-2014/11/14 Winbond Electronics Corporations in electronica 2014New Munich Trade Fair CenterHall A6 Booth 570/3.
2014/4/8-2014/4/11 Winbond Electronics Corporation America set to participate in the Freescale Technology Forum (FTF) 2014 AmericasDallas, Texas at the Gaylord Texan Resort& Convention CenterSpace Plus
2013/6/25 Winbond Electronics Corp. participated in “NuMicro™ Cortex™-M0/M4 32-bit MCU Seminar 2013” on Jun 25 in Korea. The seminar was end in a satisfactory way.Space Plus (Room 14, 6F, No. 819-10, Yeoksam-dong, Gangnam-gu, Seoul, South Korea) Space Plus
2013/04/10 , 10 : 00
|
12 : 00
Winbond Flash/DRAM Memory Applied Of Network Communication Electronic Products Online Webinar Host by Winbond Electronics at ChinaECNetChinaECNet  ChinaECNet 
2012/11/13 - 2012/11/16  Winbond Electronics Corporations in electronica 2012New Munich Trade Fair Centre, Germany  Hall A4 Booth 139 
2012/02/20  Winbond Electronics (Suzhou) Limited Opening CeremonyDouble Tree by Hilton Huaqiao / Kunshan 2F, A、B  
2010/4/12‧4/14‧4/16  Winbond Electronics and Nuvoton Technology are holding the new product launch seminar at Shenzhen, Shanghai and BeijingShenzhen‧Shanghai‧Beijing Seaview O'City Hotel(Shenzhen)‧San Want Hotel(Shanghai)‧PARK PLAZA(Beijing)
Oct/07/2008
|
Oct/11/2008
Winbond Releases Multiple Key Chips and IC Design Technologies at 2008 Taipei Taitronics AutumnTaipei World Trade Center Nangang Exhibition Hall (No.1, Jingmao 2nd Rd., Nangang District, Taipei)4F M102
Mar/03/2008
|
Mar/04/2008‧Mar/10/2008
Winbond Introduces Multiple Key Chips and IC Design Technologies at 2008 IIC-ChinaShenzhen Convention and Exhibition CenterShanghai Mart Shenzhen 2J29‧Shanghai 4B10
Oct/18/2007
|
Oct/21/2007
Winbond Releases Multiple Key Chips and IC Design Technologies at 2007 eMEX SuzhouSuzhou International Expo Center(Expo Plaza, Suzhou Industrial Park)4I28, 4B Hall
Sep/5/2007
|
Sep/8/2007
Winbond to Display Multiple Key Chips and IC Design Technologies at Electronics & Information Fair, Hangzhou, China 2007Hangzhou Peace International Exhibition & Conference CenterH13-23, G14-24
Jul/26/2007
|
Jul/29/2007
 Winbond to Display Multiple Key Chips and IC Design Technologies at Taitronics Bangkok 2007Bangkok International Trade & Exhibition Centre (BITEC)A2-A10, B1-B9
May/10/2007
|
May/12/2007
Winbond will Display Multiple Key Chips and IC Design Technologies at 2007 SemiTech Taipei ExhibitionTaipei World Trade Center P823, 824, P825, 826