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Winbond Electronics and Nuvoton Technology are holding the new product launch seminar at Shenzhen, Shanghai and Beijing


Date : 2010/4/12‧4/14‧4/16 
Location : Shenzhen‧Shanghai‧Beijing 
Booth : Seaview O'City Hotel(Shenzhen)‧San Want Hotel(Shanghai)‧PARK PLAZA(Beijing)


 

Winbond Electronics and Nuvoton Technology are holding the new product launch seminar at Shenzhen, Shanghai and Beijing

 

Shenzhen Apr. 11 th
Shanghai Apr. 14 th
Beijing Apr. 16 th

13:00-17:30
Seaview O'City Hotel
10F, Hailiang Hall
Overseas Chinese Town, Shenzhen
TEL : +86- 0755-26602222

13:00-17:30
San Want Hotel
2F, Ballroom II  & III
No.650 Yishan Road , Shanghai
TEL : +86-21-61451111

13:00-17:30
PARK PLAZA
3F, Grand Ballroom
25 Zhichun Road, Haidian District, Beijing
TEL : +86-10-82356699

Website for seminar registration: http://www.ednchina.com/customize/nuvoton/


About Winbond Electronics Corp.

Winbond Electronics Corporation is the Memory IC Company with professional capacity in product design, manufacturing, and sales services. By continuous innovation in technology, the Company strives to provide and develop customer-driven memory solutions.

As the first-rate semiconductor company, Winbond exploits its advanced design skills and production technologies to continually boost the competitive advantages of its dedicated brand-name products. Winbond’s three business groups each focus on specific fields. Of which, DRAM Product Business Group specializes in Mobile RAM and Specialty DRAM products which are designed to meet the demands of niche memory market for high-speed memory with low-power consumption. Flash Memory IC Business Group offers low/medium density NOR Flash products, including parallel Flash and serial Flash for the computer, consumer and communication markets. Based on a 300 mm wafer fab, Memory IC Manufacturing Business Group keeps pace with the latest technologies to provide high-quality memory IC manufacturing services. Now the 300 mm wafer fab is running at a monthly capacity of 37,000 wafers and production technologies covers from 90nm to 65nm.

Winbond headquarters in Central Taiwan Science Park, Taiwan, and also has subsidies in America, Japan, and Hong Kong. For more information, please visit: http://www.winbond.com

About Nuvoton Technology Corp.

Nuvoton Technology Corp. was established in July 2008 as an affiliate of Winbond Electronics Corp.. Nuvoton focuses on the development of two main product lines, including consumer electronics ICs and computer ICs. Nuvoton operates a six-inch wafer fab, that provides foundry service for the company's own branded IC products, as well as for selected manufacturing partners.

Nuvoton Technology Corp. has the advantages of core technology and customer relationships from over 20 years’ experience in IC design, manufacturing and product sale. Based on everlasting enhancement in product innovation and manufacturing efficiencies, Nuvoton provides superior service to its customers. Nuvoton will continue to realize its vision: "Be the indispensable partner to industry leaders." In line with the value Nuvoton places on its long-term relationship with its partners and customers, the company has established subsidiaries in the USA, China and Israel to strengthen regional customer support, service and global management. For more information, please visit www.nuvoton.com. 

*Note: Winbond is a registered trademark of Winbond Electronics Corp. All other trademarks and copyrights mentioned herein are the property of their respective owners.