Winbond - Business
Home \\ News & Events \ News \ Business

News - Business

 
      
 

DateDescription
Nov/11/2009Elpida and Winbond Form DRAM Manufacturing Partnership
Aug/12/2009Winbond Electronics Corporation and Insolvency Administrator of Qimonda AG Enter a Product Transfer and Technology Licensing Agreement for Graphic DRAM
Aug/04/2009Winbond Plans to Enter Product Transfer and Technology Licensing Agreement with Qimonda AG for Graphic DRAM
May/05/2009Mr. Ching-Chu Chang, Deputy CEO of Winbond, Plans to Retire and Resign from the Position as the Vice Chairman on May 31
Feb/06/2009Winbond Appointed Mr. Tung-Yi Chan as President
Feb/01/2009Winbond Makes Additional Comments on the Announcement That Qimonda AG Has Filed a Petition in Germany for Its Financial Restructuring Program
Jan/24/2009Winbond Comments on the Announcement That Qimonda AG Has Filed a Petition in Germany for Its Financial Restructuring Program
May/02/2008Winbond Board Approves its Important Designation
Apr/30/2008Winbond Regular Shareholders’ Meeting Approves the Carve-Out of its Logic IC Business named Nuvoton Technology Corporation
Apr/22/2008Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer
Mar/14/2008Winbond Board Resolved the Carve-Out of its Logic IC Business
The New Company is dubbed Nuvoton Technology Corporation
Oct/02/2007Winbond Electronics Corporation Considers Establishing A New Subsidiary Designated for the Logic IC Product Business
Jun/27/2007Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 75 nanometer and 58 nanometer Technology Transfer
Mar/22/2007Winbond sells 200mm fab to VIS
Dec/29/2006Winbond acquires land and will build R&D building close to the High-Speed Rail ChuPei Station
Aug/29/2006Winbond Electronics Corporation and Qimonda AG Announce New Agreement for Technology Transfer
Apr/20/2006Winbond Electronics held the grand opening ceremony for its 12 -inch fabrication plant at Central Taiwan Science Park
Jan/27/2006Winbond Electronics Corporation Sells FPD (Flat Panel Display) Business to Cheertek Technology, Inc.
Sep/15/2005Winbond Electronics Corporation Announces Sales Executive Management Change
Jun/24/2005Winbond Acquires NexFlash Technology
Jun/10/2005Winbond Electronics Cooperation Announces Executive Organizational Change
Apr/29/2005Winbond's Memory Business Group - Aggregate Resources and Focus on the Core Business
Mar/16/2005Winbond Electronics to Acquire the Advanced PC Business Division from National Semiconductor
Feb/02/2005Winbond Electronics Corporation Announces Executive Organizational Changes- A Further Deploy for Transformation
Aug/06/2004Winbond Electronics Corporation and Infineon Technology AG Announce New Agreement for Technology Transfer
Jul/23/2004Winbond Electronics Corporation held the ground breaking ceremony for the 12 inch fabrication plant at Central Taiwan Science Park
May/03/2004Winbond Electronics Corporation announced the project for building a fabrication plant of 12" has obtained approval from the board meeting
Apr/12/2004The subsequent to the electric power shut down in Science-Based Industrial Park last weekend, Winbond today issued that the impact to the company
Mar/15/2004Winbond Appoints Mr. James Wen as New CFO
Sep/09/2003Winbond Electronics Corporation Announces The Resignation of CFO & Vice President of Finance Center Hui-Ming Cheng
Jan/29/2003Winbond Electronics Corporation Announces Executive Organizational Changes
Oct/11/2002Winbond Electronics Corporation Receives National Invention Award from The Intellectual Property Office of Ministry of Economic Affairs, R.O.C.
Jul/01/2002Winbond Announces Dr. Keh Shew Lu as the New Board Member
May/02/2002Winbond Electronics Corporation Announces Signing of Definitive Agreement with Infineon Technologies AG for Licensing 0.11-Micron DRAM Technology
Apr/26/2002Winbond Electronics To Exhibit Innovative Chip Industry Ultra Pure Water System and Recycling System
Apr/01/2002Earthquake Report
Mar/11/2002Winbond Electronics Corporation Announces Strategic Alliance with Infineon Technologies AG for 0.11-Micron DRAM Technology
Dec/28/2001Winbond Electronics Corporation Announces The Resignation of Vice Chairman Ding Yuan Yang
Dec/21/2001Winbond Electronics Corporation Launches Winbond's Enterprise Intelligence System"WEIS"
Dec/06/2001Winbond Electronics Corporation America Achieves QS-9000 Certification
Nov/08/2001Winbond Electronics Corporation and Sharp Corporation Announce New Joint Development Agreement for Developing Advanced Contactless Technology
Oct/30/2001Winbond Establishes A New Company Dedicated to Multimedia IC Development
Sep/24/2001Winbond Introduces Non-Volatile Memory Products and Modules To The U. S. market
Aug/28/2001Winbond Electronics Corporation Announces Update On Corporate DRAM Strategy And Discloses New Plans for 12-Inch Fab
Aug/01/2001Winbond Electronics Corporation Announces Organizational Changes
Jul/27/2001Winbond Electronics Corporation Licenses Mobile-FCRAM from Fujitsu
Jul/12/2001Winbond Electronics Corporation Announces Successful Establishment of B2B Process Integration Scheme
May/01/2001ISD Israel changes name to Winbond Electronics Corporation Israel Ltd.
Dec/11/2000Winbond Appoints Mr. Hui-Ming Cheng as New CFO Corporate Finance, 2000
Dec/06/2000Winbond Receives"Outstanding Electronic Components Suppliers of Year 2000" Award
Oct/19/2000Winbond Comments On International Trade Commission Findings
Aug/15/2000Winbond Electronics Corporation Names Tsuyoshi Kawanishi As Company's Newest Board Member
Jul/24/2000Winbond's Speech Recognition ISD SIMON Chip Solution Wins L'ECTRON D'OR 2000,Product of The Year Award
Jun/16/2000Winbond Assists National Chi Nan University in Establishing New Multimedia & Communications Lab
Jun/11/2000Earthquake Report
May/31/2000Winbond Announces Corporate Reorganization Winbond Announces Corporate Reorganization
Apr/26/2000Winbond and Toshiba Join Hands In DRAM Technology Development
Apr/08/2000Winbond to Join in Fujitsu-Toshiba DRAM Development Program
Mar/20/2000Winbond Electronics Honorably Won the International QS-9000 Quality Authentication
Jan/01/2000Winbond Issues Y2K Update on Fab Conditions from Taipei
Jan/01/2000Winbond Issues Y2K Update on Fab Conditions from San Jose