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Winbond Electronics Corporation Receives National Invention Award from The Intellectual Property Office of Ministry of Economic Affairs, R.O.C.
Oct/11/2002

 
(Taipei News) October 11, 2002 - Winbond Electronics Corporation, a leading supplier of semiconductor solutions, today announced that it has received the Silver Metal of the 11th annual National Invention Award, presented by the Intellectual Property Office of the Ministry of Economic Affairs, R.O.C. The honor was awarded to Winbond's in recognition of the Corporation's long-term efforts to create and support Intellectual Property in R&D.

The goal of the National Invention Award, which is presented by the Intellectual Property Office of the Ministry of Economic Affairs, is to select the best inventor or organization, reward creative invention, create momentum for the country's R&D and enhance Taiwan's technology standards. It is the highest honor in Intellectual Property in the country. This award is based on the quantity of patents, value of patent protected products with respect to current economic conditions, employee participation in R&D, and IP precautionary measures.

Winbond is a self-branded, global semiconductor company, offering design, production and manufacturing capabilities. In addition, the Company has maintained a long-term focus on R&D. Since 1991, Winbond has consistently been awarded the, "R&D investment Award" presented by the Science-Based Industrial Park. The Company currently holds more than 1300 patents worldwide, with more than 1,000 patents pending, also worldwide.

Winbond patents fall mainly into four major categories; Consumer IC products, PC peripherals, Communications and Memory. During the past four years, these patents have contributed nearly $20 Billion NT. This year, Winbond was also has been listed as one of the top 50 R&D companies in "e-World" magazine. In addition, the Company received three awards for R&D expenditure, revenue-to-R&D expenditure ratio and as the Company with the most patents awarded. The Silver Metal Invention Award is the third award the Company has received from the National Intellectual Property office of the Ministry of Economic Affairs. Winbond received the silver award in 1993 and the gold award in 1999.

"Since the Company's inception, Winbond has maintained a strategic focus on R&D in order to fully develop new technology that successfully address new product trends and enable the Company to create winning solutions in the form of complementary suites of products," noted Winbond's President, CC Chang. "Over the years, Winbond has created many cutting edge, value-add products aimed at innovative applications and growing markets. Pursuing trends of system integration and the independent development of diversified Intellectual Property, IP has become one of Winbond's most powerful strategic assets. This award has honored Winbond's efforts in establishing and building Intellectual Property; the outcome of which can be seen in both the quality and quantity of our patents. On behalf of all of Winbond, I wish to thank the Ministry of Economic Affairs and judges for this honor. It is Winbond's collective hope that the National Invention Award selection activity will continue to stimulate more innovation throughout Taiwan and help bring about technology advancements."




Spokesperson
    Wilson Wen
    Vice President of Administrative Center
    Tel:03-5792755
 
News Liaison
    Mike Liu
    Deputy Director
    Tel:03-5792516
    Email:ckliu@winbond.com