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Serial Flash

SpiFlash® Memories with SPI, Dual-SPI, Quad-SPI and QPI

Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 512M-bit to 512K-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than eight times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry. Additionally, new ultra-small form factor packages are ideal for space constrained mobile and handheld applications.

Leading the Serial Flash Market in unit sales and revenue, Winbond TS16949 certified AEC-Q100 qualified memories now support automotive applications. The automobile has transformed into the most sophisticated electronic device in the market. Digital displays in automotive dashboards provide more information about the car, and improve safety. Instant-on and real time 2D/3D image rendering is achieved with fast processors and SpiFlash memories. ADAS (Advanced Driver Assist Systems), comfort, entertainment, and navigation is now available in the center console and this is addressed with SpiFlash memories using small packages for space constrained systems and high density for advanced applications. 


Please contact Winbond for automotive datasheet and support.

 Smallest Serial Flash Packages Available                                    Winbond Industrial and Automotive Grade Memory

 

Industrial

Industrial
Plus

Automotive
Grade 3

Automotive
Grade 2

Temperature Range

-40°C~85°C

-40°C~105°C

-40°C~85°C

-40°C~105°C

Part #
Example

W25Q80BVSS I G

W25Q80BVSS J G

W25Q80BVSS B G

W25Q80BVSS A G

AEC-Q100 Compliant

No

No

Yes

Yes

Change
Control (PPAP)

No

No

Optional

Optional

Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5 Purchase
W25M512JV

Dual/Quad-SPI, QPI,
DTR, Enhanced3

2.7V - 3.6V

104

SOIC16 300mil,
WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4

UD  UD     



256Mbit (32MB)

Part No. Features Voltage Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q256FV

Dual/Quad-SPI, QPI, Enhanced3

                        2.7V - 3.6V 104

SOIC16 300mil,
WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4

P UD  
W25Q257FV 

Dual/Quad-SPI, QPI, Enhanced3,
 4-byte addressing

2.7V - 3.6V 104

SOIC16 300mil, WSON8 8X6mm

P N   
W25Q256JV

Dual/Quad-SPI, QPI, DTR, Enhanced3


2.7V - 3.6V

 104

SOIC16 300mil,
WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4

UD  UD       


128Mbit (16MB)
Part No. Features Voltage Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q128BV

Dual/Quad-SPI,
Enhanced3

                        2.7V - 3.6V 104

SOIC8 208mil,SOIC16 300mil,
WSON 6X5mm

N  P  
W25Q128FV 

Dual/Quad-SPI, QPI,
Enhanced3

2.7V - 3.6V 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

P  UD   
W25R128FV

Dual/Quad-SPI,QPI, RPMC, Enhanced3


2.7V - 3.6V
104

SOIC8 208mil, SOIC16 300mil4,
WSON 6X5mm4,
VSOP8 208mil4

P N
W25Q128JV 

Dual/Quad-SPI, QPI, DTR, Enhanced3

2.7V - 3.6V 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

UD UD   
W25Q128FW

Dual/Quad-SPI, QPI, Enhanced3

1.65V - 1.95V 104

SOIC8 208mil, SOIC16 300mil4
WSON 6X5mm

P  N


64Mbit (8MB)
Part No. Features Voltage Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q64CV 

Dual/Quad-SPI,
Enhanced3

                        2.7V - 3.6V 80

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm, PDIP8 300mil4,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

N P  
W25Q64FV 

Dual/Quad-SPI, QPI,
Enhanced3

2.7V - 3.6V 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

P  N   
W25R64FV 

Dual/Quad-SPI,QPI
RPMC, Enhanced3


2.7V - 3.6V
104

SOIC8 208mil, SOIC16 300mil4,
WSON 6X5mm4,
VSOP8 208mil4

P N
W25Q64JV

Dual/Quad-SPI, QPI,
DTR, Enhanced3

2.7V - 3.6V 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix),
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

UD N     
W25Q64FW 

Dual/Quad-SPI, QPI,
Enhanced3

1.65V - 1.95V 104

SOIC8 208mil, WSON 6X5mm,
VSOP8 208mil4

P UD


32Mbit (4MB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q32BV

Dual/Quad SPI,
Enhanced3

                        2.7V - 3.6V 104

SOIC8 208mil,SOIC16 300mil,
WSON 6X5mm,WSON8 8X6mm, 
PDIP8 300mil4
TFBGA24 6X8mm (4x6 Matrix)4

N  P  
W25Q32FV

Dual/Quad-SPI, QPI,
Enhanced3

2.7V - 3.6V 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4 

P  N   
W25Q32JV

Dual/Quad-SPI, QPI,
DTR, Enhanced3


2.7V - 3.6V

 104

SOIC8 208mil, SOIC16 300mil,
WSON 6X5mm, WSON8 8X6mm,
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 208mil4

UD  UD    
W25Q32DW

Dual/Quad-SPI, QPI,
Enhanced3

1.65V - 1.95V 104

SOIC8 208mil, WSON 6X5mm,
SOIC16 300mil4, VSOP8 208mil4

N N  
W25Q32FW

Dual/Quad-SPI, QPI,
Enhanced3

1.65V - 1.95V 104

SOIC8 208mil, WSON 6X5mm,
SOIC16 300mil4, VSOP8 208mil4,
WSON8 8X6mm4, XSON8 4x4mm

UD  UD   


16Mbit (2MB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q16CV 

Dual/Quad SPI,
Enhanced3

                        2.7V - 3.6V 80/104

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, PDIP8 300mil4,
TFBGA24 6X8mm (4x6 Matrix)4

N P  
W25Q16DV 

Dual/Quad-SPI Enhanced3

2.7V - 3.6V 80/104

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, 
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 150mil4, VSOP8 208mil4

P  N   
W25Q16CL

Dual/Quad-SPI,
Enhanced3


2.3V - 3.6V

 50/80

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil4

P N
W25Q16DW

Dual/Quad-SPI, QPI,Enhanced3

1.65V - 1.95V 104

SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil4, WSON 6X5mm, VSOP8 208mil4,
USON8 4x3mm, WLBGA84

P  P  
W25Q16FW 

Dual/Quad-SPI, QPI,Enhanced3

1.65V - 1.95V 104

SOIC8 150mil, SOIC8 208mil,
SOIC16 300mil4, WSON 6X5mm, 
TFBGA24 6X8mm (4x6 Matrix)4,
TFBGA24 6X8mm (5x5 Matrix)4,
VSOP8 150mil4, VSOP8 208mil4,
USON8 4x3mm, WLBGA84

UD N   


8Mbit (1MB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25Q80BV

Dual/Quad-SPI
Enhanced3

                        2.7V - 3.6V 80/104

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, USON8 2X3mm

P P  

W25Q80DV

Dual/Quad-SPI
Enhanced3

2.7V - 3.6V 80/104

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, USON8 2X3mm,
VSOP8 150mil

P N    
W25Q80BL

Dual/Quad-SPI,
Fast Write,
Enhanced3

2.3V - 3.6V 50/80

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
USON8 2X3mm

P N
W25Q80DL

Dual/Quad-SPI,
Fast Write,
Enhanced3

2.3V - 3.6V 50/80

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,
USON8 2X3mm

P N  
W25Q80BW

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65V - 1.95V 80

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil,  WLBGA84

P
W25Q80EW 

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65V - 1.95V 80

SOIC8 150mil, SOIC8 208mil,
WSON 6X5mm, VSOP8 150mil, 
USON8 4x3mm4, WLBGA84

UD   


4Mbit (512KB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25X40CL

Fast Write,
Dual SPI


2.3V - 3.6V
104

SOIC8 150mil, VSOP8 150mil,
USON 2X3mm, WSON 6X5mm,
SOIC8 208mil

P N
W25Q40CL 

Dual/Quad-SPI,
Fast Write,
Enhanced3

2.3V - 3.6V 104

SOIC8 150mil, SOIC8 208mil,
USON8 2X3mm4

P N  
W25Q40BW

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65V - 1.95V 80

SOIC8 150mil, SOIC8 208mil4,
WSON 6X5mm,VSOP8 150mil,
USON8 2X3mm

P
W25Q40EW

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65V - 1.95V 80

SOIC8 150mil, SOIC8 208mil4,
WSON 6X5mm,VSOP8 150mil,
USON8 2X3mm, USON8 4x3mm4

UD   


2Mbit (256KB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25X20CL

Fast Write,
Dual SPI


2.3 - 3.6V
and
 2.7-3.6V
50/104

SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm

P N
W25Q20CL

Fast Write,
Dual/Quad SPI

2.3 - 3.6V
and
 2.7-3.6V
50/104

SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm

P N  
W25Q20BW

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65 - 1.95V 80

SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm4

P P
W25Q20EW

Dual/Quad-SPI,
Fast Write,
Enhanced3

1.65 - 1.95V 80

SOIC8 150mil, WSON 6X5mm,
VSOP8 150mil, USON8 2X3mm4

UD   


1Mbit (128KB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5  Purchase
W25X10CL 

Fast Write,
Dual SPI

2.3 – 3.6V
and 
2.7 – 3.6V
50/104

SOIC8 150mil, USON8 2X3mm

N
W25Q10EW

Dual/Quad-SPI,
Fast Write

1.65 - 1.95V 80

SOIC8 150mil, WSON 6X5mm4,
VSOP8 150mil4, USON8 2X3mm

UD   


512Kbit (64KB)
Part No. Features Voltage  Clock (MHz)  Package(s)

Status1,2

Automotive5 Purchase
W25X05CL 

Fast Write,
Dual SPI

2.3V - 3.6V 104

SOIC8 150mil,  TSSOP8 173mil4,
USON 2x3mm

P N

Status1: P= Mass Production, S (Time)=Samples (Ready Time), UD (Time)=Under Development (Ready Time), N=Not recommended for new designs

RoHS 2 : All Winbond Flash products are "Green", Halogen-Free and RoHS compliant packaging. Refer to the datasheet for details and specifications.
Enhanced3 = SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Registers, Complement Array Protection
Special Order Packages4 = These packages are available, but as special order only and will need a longer lead time prior to production.
Automotive Packages5 = Contact Winbond sales for availability of packages on Automotive products.



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